While many in the industry believed that the original TorFloor panel represented the optimum in terms of integrating underfloor heating pipes into a quick-to-install structural flooring panel, UK based manufacturer OMNIE has taken both the practicality and the performance to a new level with the introduction of TorFloor 2.
The new generation TorFloor 2 evolves from the market-leading TorFloor predecessor by adding a 6mm thick chipboard upper panel with pre-foiled aluminium heat diffuser. Crucially both panels feature matching routed channels to perfectly align around the 12mm water pipe, while the printed upper face clearly indicates the pipe’s position and the points where screws can be safely fixed.
Not only does this arrangement greatly reduce the risk of the pipe runs being accidentally damaged when floor coverings are installed or replaced, but the location of the routed channels places the warm water pipes closer to the surface: delivering faster warm-up times. This design means that an output of 50 W/m2 can be achieved with a flow temperature of 410 Centigrade, making TorFloor 2 ideal for coupling with the air or ground source heat pumps offered by OMNIE, while a 500 Centigrade flow will raise the output to 84 W/m2.
Brendan Hourican, sales director for OMNIE, commented: “The launch of TorFloor 2 is an important landmark for our brand, helping ensure we will maintain our market leading position in the underfloor heating industry, while offering building occupants and specifiers, high efficiency in operation.”